Web31 dec. 2012 · Understanding Fine Leak Testing in Accordance with Method 1014, MIL-STD-883. December 2012. DOI: 10.1016/B978-1-4377-7877-9.00005-2. In book: Hermeticity of Electronic Packages (pp.107-147 ... WebMIL-STD-883H 1 1. SCOPE 1.1 Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within …
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WebMIL-STD-883, Method 1014, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K MIL-STD-883, Method 1004 Resistance to Solvents MIL-STD-202, Method 215 J-STD-020, MSL 1 Solderability MIL-STD-883, Method 2003 Temperature Cycling Fine Leak Test Gross Leak Test WebMIL-STD-883, or invoke it in its entirety as the applicable standard (see 1.2.2 for noncompliant devices). a. Custom monolithic, non-JAN multichip and all other non-JAN microcircuits except non-JAN hybrids described or implied to be compliant with methods 5004 and 5005 or 5010 of MIL-STD-883 are required to meet all of the non- Webgross leak test mil-std-883, method 1014, test condition c fine leak test mil-std-883, method 1014, test condition a terminal strength mil-std-202, method 211, test condition a and c marking ink epoxy, heat cured. moisture resistance mil-std 202, method 106, omit step 7b solderability mil-std-202, method 208, 95% coverage solvent resistance mil ... grand modus 2011